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Apple and AMD Fueling TSMC's SoIC Packaging Boom

April 28, 2025

TSMC is making waves in the tech world with its SoIC (system on integrated chips) advanced packaging. This isn't just any packaging. It's a game-changer, offering lower power use and other perks. Two big names are pushing this tech forward: Apple and AMD. These companies are placing big orders, driv

entertainment

Pac-Man Fun Comes to Life in Tokyo: A Web3 Adventure!

November 20, 2024

Get ready for a super fun and interactive event in Tokyo! Web3 platform Flickplay has teamed up with the creators of Pac-Man, Bandai Namco Entertainment, and the City of Shibuya. The action starts at the DIG SHIBUYA 2025 Festival from February 8 to 11, 2025. This isn't just any event—it blends digit

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